It looks like 193nm chipmaking kit will be able to remain on the field of play for a little while longer
IBM Research has come up with a way to draw lines in silicon 29.9nm apart with existing chipmaking machines, far closer than on today’s chips, a development that could help cut the cost of making chips in the future.
The breakthrough revolves around an enhanced, experimental version of immersion lithography. In immersion lithography, silicon wafers are immersed in purified water. Laser light shining through an intricate mask throws a microscopic shadow pattern onto the wafer, which then becomes permanent through chemical processes similar to the process in which a negative becomes a photographic print
The wafers are immersed in water because light bends light rays better than air, which in turn can lead to sharper resolution and smaller patterns. Immersion lithography will start getting used commercially in the relatively near future.
In IBM’s system, light from the laser is split into two beams. Then, a tool called Nemo weaves the two beams to create an interference pattern that allows for a pattern with more closely etched lines that can be achieved in standard immersion lithography.
The system also swaps out water with a special fluid from JSR Micro, as well as using a specialised prism, and a special photoresist system.
"We can routinely do sub-30nm spacing," said Robert Allen, manager of lithography materials at the Almaden Research Centre, IBM Research.
If the Nemo system ultimately goes commercial, the process could let the industry wring more life out of 193nm lithography systems installed today.
Related Posts
- This Laser Trick’s a Quantum Leap
- Cd Copy Stopper
- P2P saves Windows users from Viruses
- Nintendo’s Wii may get early launch
- New iPod nano uses human skin to transmit audio
Loading ...
